Functieprofiel
Your role:
Partner with internal and external customers on requirements and product solutions
Develop new and differentiating architectures, perform feasibility studies, compare competitor solutions and define IP roadmap
Proposing and selecting IC processes and packages, optimal for product portfolio, costs and customer acceptance
Translate product requirements into IC solutions while trading off performance, area and cost
Define and document architecture with specifying functional and parametrical block-requirements including design for test solutions
Work daily in local multi-functional teams of package architects, design engineers, device physicist, test and product engineers, product manager and project leader
Communicate with foundry and subcon engineering support groups to achieve technical insights in IC process and package technology capability and methods for product introductions
Act as an accountable technical lead in complex projects
Perform actual design, optimization and simulations of IC blocks and top-level circuits using Synopsys/Cadence tools and target First Time Right designs
Perform full statistical verification of datasheet parameters
Carrying out IP bench validation and support product and test engineering with the validation of datasheet parameters
Perform design reviews, evaluations, characterization and test results
Proactively share knowledge and best practices with your design team
Contribute to improve way of working in the R&D group
Bedrijfsprofiel
Nijmegen: 3 days / week on-site preferred.
About the team:
Your position will be based in our client's design group and you will be working in projects with a complete team responsible for system engineering, design, characterization, test and qualification of products, EDA support and industrialization of high-volume products. You will be located in Nijmegen R&D center. Other R&D centers are in Penang, Shanghai and Dallas.
Functie-eisen
Experience Required:
Masters’ degree or PhD in Electrical & Electronic Engineering
Proven experience in RF Analog Circuit Design and related design flows
Skilled with Synopsys or Cadence schematic design, simulator, layout and verification tooling
Experienced with signal ICs
Full competence with all aspects of Analog design and affinity with digital designs
Experienced in 0.18um to 0.11um CMOS and BCD processes of the Semiconductor industry
Experience in Plastic Package and Wafer Level Package technologies
Knowledge and experience with Electrostatic Discharge and Latch-Up mechanisms and application of ESD protection strategies and devices
A thorough understanding of Semiconductor Physics and Device operation
Good communication skills in English, both written and spoken
Experience as Technical Lead and RF Analog design
Please contact me: kerry.barclay@akkodisgroup.com